Stress Plugin

    Stress plugin for a variety of purposes from QC to R&D

    • sin²ψ, 2D-stress and Multiple HKL methods are supported
    • Residual stress analysis from bulk to thin film samples
    • Principal and tri-axial residual stress analysis using 2-D method
    • Stiffness tensor or Young’s modulus & Poisson’s ratio for calculation

    Residual stress analysis.

    In the stress plugin, the residual stress of a polycrystalline material can be quantitatively evaluated with X-ray diffraction data. In addition to ordinary stress analysis by the sin²ψ method, the stress tensor and the principal stress can be also analyzed under an assumption of the plane stress state: σ₁₁, σ₂₂ and σ₁₂, or the triaxial stress state: σ₁₁, σ₂₂, σ₃₃, σ₁₂, σ₂₃ and σ₁₃. The multiple hkl method, effective for thin film stress analysis, is also available in this stress plugin. The residual stress of a thin film can be analyzed with multi-directional strains in different diffraction planes, assuming the plane stress state. In the data processing function, all data from 0D, 1D and 2D modes can be loaded, and data processing, such as 2D diffraction data segmentation, smoothing, background elimination, LPA correction, Ka₂ elimination, peak position searching and profile pattern fitting, is easily done.

    Moreover, the diffraction angle in the strain-free state (2θ₀), and the X-ray elastic constants (E, ν, K, S1 and ½S₂) can be calculated utilizing an extensive material database. The grain interaction model used for the calculation of the X-ray elastic constant can be arbitrarily selected from four models: 1) Reuss model: the stress is constant among the grains, 2 ) Voigt model: the strain is constant among the grains, 3) Neerfeld-Hill model: an arithmetic average between Reuss and Voigt, and 4 ) Kröner model: a large number of spherical grains of single crystal having the elastic anisotropy exist in a polycrystalline matrix.

    Finally, the highly flexible stress plugin enables various stress analyses according to a wide range of purposes, from quality control to research and development.

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