MFM310
Features
- Micro-spot X-ray beams and pattern recognition
- High-throughput, product-wafer measurements
- Wide range of materials and applications
- High resolution and precision covering thicknesses from Ångstroms to microns
- For 200 mm and 300 mm wafers
- Available with 300 mm factory automation
- Design based on SEMI S2 and SEMI S8
Process XRR, XRF, and XRD metrology FAB tool
Thickness, density, roughness & composition of films on blanket and patterned wafers
Specifications
Product name | MFM310 |
Technique | X-ray reflectivity, fluorescence and diffraction |
Benefit | Measure ultra-thin single-layer films to multi-layer stacks |
Technology | Process micro-spot XRR, XRF, XRD with 2 FOUP load ports |
Core attributes | CE marked, S2 / S8 / GEM-300 / HSMS compliance |
Core options | Available with 300 mm factory automation |
Computer | Internal PC, MS Windows® OS |
Core dimensions | 1400 (W) x 2050 (H) x 3410 (D) mm |
Mass | n/a (core unit) |
Power requirements | 3Ø, 208 VAC 50/60 Hz, 2.5 kW |