Film thickness/composition and wafer contamination tools
Rigaku is a pioneer and world leader in designing and manufacturing X-ray technology based instrumentation to solve manufacturing challenges in semiconductor R&D and production. With more than 35 years of global market leadership in this industry, our families of products enable everything from in-fab process control metrology to R&D for thin film and materials characterization. Our X-ray Diffraction (XRD), X-ray Fluorescence (XRF), X-ray Reflectometry (XRR) and X-ray topography (XRT) metrology tools measure critical process parameters like thin film: thickness, composition, roughness, density, porosity, and crystal structure and crystal structure defects. In addition, we offer process Total Reflection X-ray Fluorescence (TXRF) and Vapor Phase Decomposition-Total Reflection X-ray Fluorescence (VPD-TXRF) tools for contamination measurement. With global 24/7 service and support, Rigaku delivers cutting-edge solutions for your yield enhancement and process development.
Application Notes
The following application notes are relevant to this industryXRD
X-ray CT, Computed tomography
WDXRF
EDXRF
Rigaku recommends the following systems:
Semiconductors
Process XRR, XRF, and XRD metrology tool for blanket and patterned wafers; up to 300 mm wafers
Sequential WDXRF spectrometer for elemental analysis and thin-film metrology of large and/or heavy samples
In-line, simultaneous WDXRF spectrometer for wafer metal film metrology; up to 300 mm wafers
Ultra-trace elemental surface contamination metrology by TXRF with VPD capability; up to 300 mm wafers
XRD
Advanced state-of-the-art high-resolution XRD system powered by Guidance expert system software
X-ray CT
X-ray topography (XRT)
A fast, high-resolution laboratory X-ray topography system for non-destructive dislocation imaging