X-ray stress analyzer

Non-destructively measurement of residual stress accumulated in a material

MSF/PSF-3M

These analyzers use X-ray diffraction to nondestructively test residual stress in materials. Residual stress may be created during the manufacturing process of a material, or it may accumulate in a structure over many years in operation. In either case, this stress can have a serious negative effect on a product's quality, durability and lifetime.

Accurate detection of residual stress is an important element of the quality control process and helps predict the service lifetime of products.

These Rigaku systems handle small, medium and large components, depending on the system configuration.

An optional radiation enclosure is available to ensure complete operational safety, thus creating a system capable of simple, safe and reliable measurements.

Features

  • Operational productivity
  • Handles diverse materials
  • Compact design
  • Design emphasis on safety
  • Easy operation through intuitive menus
  • Simple measurement using auto measurement mode


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