Thin films on silicon

This App Note demonstrates the capabilities of the Rigaku NEX CG EDXRF analyzer for the measurement of thin film thickness (Tox) applied to semiconductor wafers. Simple 2-point empirical calibrations are used for SiO2, AlSi, Ti, TiN, Pt, AlCu, and BPSG single layer films on silicon substrates for use in quality control in the semiconductor industry.

Background

Process control in semiconductor manufacturing is critical. Tight tolerances leave little margin for error in the processing of semiconductor materials. Film thickness and concentration integrities are vital to optimal device performance. Semiconductor processing involves the sequential deposition of multiple layers to complete the device. Any errors during the construction of these devices can lead to undesirable effects in future processing and lead to device failure or degradation.

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Rigaku NEX CG delivers rapid qualitative and quantitative determination of major and minor atomic elements in a wide variety of sample types — with minimal standards. Unlike conventional EDXRF analyzers, the NEX CG was engineered with a unique close-coupled Cartesian Geometry (CG) optical kernel that dramatically increases signal-to-noise. Read more...

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