Residual stress analysis

Non-destructive residual stress analysis for metals

Residual stress analysisResidual stress may be created during the manufacturing process of a material, or it may accumulate in a structure over many years in operation. In either case, this stress can have a serious negative effect on a product's quality, durability and lifetime. Accurate detection of residual stress is an important element of the quality control process and helps predict the service lifetime of products.

X-ray diffraction (XRD) is presently the only accurate way to non-destructively measure residual stress. In addition, XRD offers non-contact measurements with unsurpassed spatial resolution and the ability to measure hardened materials. Residual stress, of either exceptionally strained points or the surfaces of moving parts, is routinely determined by XRD. To meet the requirements of these tasks, Rigaku offers several systems to allow flexible component and sample handling for every budget and need.

Systems

PSPC/MSF   PSPC/MSF
Advanced XRD stress analyzer features a position-sensitive proportional counter (PSPC) permitting high-speed measurements
  MSF/PSF-3M   MSF/PSF-3M
Non-destructively test residual stress in materials, with configurations available for any sample size
   
SmartSite RS   SmartSite RS
Battery operated small portable stress analyzer with WiFi based remote control
  AutoMATE II   AutoMATE II
Micro-area X-ray residual stress measurement system with both iso- and side-inclination methods