Semiconductor metrology for BEOL (back end of line) processes
Rigaku provides semiconductor metrology tools that enable optimization of operations performed on semiconductor wafers in the course of device manufacturing following first metallization. Example applications include:
- Porous low-k interlayer dielectrics
- Barrier metals
- Interconnects
- Cu seed and barriers (thickness, density, and roughness)
- Cu plating
- Cu CMP (thickness, dishing, and erosion)
- Cu systematic voiding
- Advanced barriers (Ti/TiN, Ta/TaN, ALD barriers)
- Top barriers and etch stops (CoWP, CoWB, SiC, SiCN)
- Low-k dielectrics (thickness, density, porosity, pore size and distribution)
Measuring thickness with atomic scale sensitivity, Rigaku X-ray metrology systems deliver critical information on the composition and structure of advanced semiconductor materials at today's technology nodes and beyond. A pioneer and world leader in designing and manufacturing X-ray based measurement tools to solve semiconductor manufacturing challenges, Rigaku has provided over 30 years of global semi metrology leadership.