TXRF 300 total reflection XRF spectrometer

Quick contamination inspection for semiconductor processes

• Accepts 300 mm (12"), 200 mm (8") and 150 mm (6")
• Effective inspection of process contamination at various stages, cleaning, film deposition, exposure, etching, etc.

Wide range of analytical elements (Na~U), high performance ultra trace analysis

• Single target 3 beam method and XYZθφ stage are unique to Rigaku enabling highly accurate ultra trace analysis over the entire wafer surface

Notch search/centering of wafer on the sample stage

• Coordinates of the wafer can be made accurately
• Easy and accurate analysis position identification

FOUP (SMIF) integrated

• C-to-C standard
• Various cassettes can be loaded
• FOUP (SMIF), through-the-wall option is available to meet the various needs of wafer fabs

Highly accurate mapping measurements can be made using Rigaku's unique sample stage

• Comparison of W-L β escape peak (which interferes with Cu Ka) between XYZθφ stage (Rigaku) and rθ stage (Competitor)