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Texture analysis of a Cu wiring film using the Orientation Distribution Function (ODF)

AppNote B-XRD1087: texture analysis of a Cu wiring film using ODF

Background

Since there is a strong relation between the material characteristics and the crystal orientation of metals and many other industrial materials, quantitative analyses of crystallites orientation and their distributions are of great importance. Pole figure measurements are a common method to quantitatively analyze orientation. In this Application Byte, we used the Orientation Distribution Function (ODF) to evaluate the crystallites orientation of a Cu wiring film from a pole figure measurement.

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