Semiconductors
X-ray metrology solutions from lab to fab
Semiconductors have the power to change the world for the better. Rigaku strives to make this a reality as the leading global supplier of X-ray metrology tools for semiconductor process R&D and high-volume manufacturing.
Rigaku is a leading manufacturer of X-ray technology-based instruments that solve manufacturing challenges in semiconductor R&D and production. With over 70 years of global market leadership, our advanced families of products provide solutions for everything from in-fab process control metrology to R&D for thin film and materials characterization.
AZX 400
WDXRF sequential spectrometer for light-element and metal film thickness and composition measurements for up to 400 mm coupons, sputtering targets, and wafers
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WDA-3650
WDXRF simultaneous spectrometer for light-element and metal film thickness and composition measurements on wafers and media disks for up to 200 mm wafers
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WaferX 310
WDXRF simultaneous spectrometer for thickness and composition measurements for up to 300 mm wafers
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ONYX 3000
EDXRF and optical hybrid metrology tool for automated X-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers for up to 300 mm wafers
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ONYX 3200
EDXRF and optical hybrid metrology tool for automated X-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers for up to 300 mm wafers
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XHEMIS EX-2000
Enables high-throughput measurements on blanket wafers ranging from ultra-thin single-layer films to multilayer stacks for process development and film quality control.
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XTRAIA MF-3000
XRR, EDXRF, and XRD metrology tool for composition and thickness (EDXRF), thickness, density, and roughness (XRR) for unpatterned and patterned films for up to 300 mm wafers
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XTRAIA MF-3400
Multi-functional XRR / XRD / XRF metrology system for thin-film analysis and process control for patterned wafer up to 300 mm.
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XTRAIA MF-2000
XRR, EDXRF, and XRD metrology tool for composition and thickness (EDXRF), thickness, density, and roughness (XRR) for unpatterned and patterned films for up to 200 mm wafers
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XHEMIS TX-2000
Next-generation total-reflection XRF system for surface-metal control in semiconductor fabs for wafers up to 200 mm
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TFXRD Lab
HRXRD and XRR system for thickness, density, roughness, composition, strain, relaxation, and RSM characterization of unpatterned epitaxial films with full-wafer mapping capability for near-fab applications for up to 300 mm wafers
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TFXRD Near Fab
HRXRD and XRR system for thickness, density, roughness, composition, strain, relaxation, and RSM characterization of unpatterned epitaxial films with full-wafer mapping capability for near-fab applications for up to 200 mm wafers
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XTRAIA XD-3200
HRXRD and XRR metrology tool for thickness, density, roughness, composition, strain, relaxation, and RSM characterization of unpatterned epitaxial films for up to 300 mm wafers
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XTRAIA XD-2000R
Non-destructive X-ray reflectometry metrology tool for multilayer films, EUV masks, and advanced thin-film applications.
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XTRAIA XD-3300
XTRAIA XD-3300 HRXRD and XRR metrology tool for thickness, density, roughness, composition, strain, relaxation, and RSM characterization of unpatterned and patterned epitaxial films for up to 300 mm wafers
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XTRAIA CD-3200T
TSAXS metrology tool for critical dimension (CD) and profile shape characterization of deep (high aspect ratio) structures for 300 mm wafers
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XTRAIA CD-3010G
GISAXS and XRR metrology tool for critical dimension (CD) and profile shape characterization of shallow structures and XRR characterization of film thickness, density and roughness for 300 mm wafers
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XRTmicron (Lab)
XRT (X-ray topography) imaging system for emerging power electronics, optoelectronics, and 5G / 6G communications (SiC, GaN, GaAs, InP, Ga₂O₃) for up to 300 mm wafers
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XTRAIA XT Series (Fab)
High-resolution, non-destructive wafer defect visualization for semiconductor manufacturing
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XTRAIA TF Series
High-resolution, non-destructive full-wafer characterization for thin film manufacturing
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FSAS II
XRD system for measurement and control of crystal orientation for up to 150 mm wafers, ingots
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FSAS III
XRD system for measurement and control of crystal orientation for up to 150 mm wafers, ingots
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SmartLab
Advanced, state-of-the-art, high-resolution XRD system powered by Guidance expert system software
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