Background

This paper demonstrates the capabilities of the Rigaku NEX CG EDXRF analyzer for the measurement of thin film thickness (Tox) applied to semiconductor wafers. Simple 2-point empirical calibrations are used for SiO₂, AlSi, Ti, TiN, Pt, AlCu, and BPSG single layer films on silicon substrates for use in quality control in the semiconductor industry. Process control in semiconductor manufacturing is critical. Tight tolerances leave little margin for error in the processing of semiconductor materials. Film thickness and concentration integrities are vital to optimal device performance. Semiconductor processing involves the sequential deposition of multiple layers to complete the device. Any errors during the construction of these devices can lead to undesirable effects in future processing and lead to device failure or degradation.