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Lead in lead-free solder

AppNote XRF1550: analysis of lead (Pb) in lead-free solder

Background

The measurement of lead in lead-free solder is demonstrated by rapid XRF screening for RoHS, WEEE and ELV directives. Lead content (Pb) is limited in most solder applications according to regulations RoHS, WEEE and ELV initiatives.These regulations limit the maximum allowable Pb in solder to no greater than 0.1000% Pb (1000 ppm). Energy Dispersive X-ray Fluorescence (EDXRF) is an accepted analysis technique for the rapid screening to determine whether Pb is below allowable limits. Fast and simple to operate, the NEX DE VS system offers screening for Pb content and use of camera view and automatic small spot collimators down to 1 mm spot size, making it an ideal tool for rapid screening to ensure regulation compliance.

EDXRF products from Rigaku

High-performance, Cartesian-geometry EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin films

New variable collimator small spot 60 kV EDXRF system featuring QuantEZ software.

New 60 kV EDXRF system featuring QuantEZ software and optional standardless analysis

Low-cost EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin-films

Performance EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin-films

EDXRF spectrometer with powerful Windows® software and optional FP.

Scanning multi-element process coatings analyzers for web or coil applications

EDXRF multi-element process analyzer; analyze aluminum (Al) through uranium (U)