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Electroless Nickel plating

AppNote XRF1720: analysis of Ni, P and Pb on metal substrates

Background

Measurement of nickel, phosphorus and lead in electroless nickel plating on various metal substrates is demonstrated. nickel-boron coating, providing an even, protective coating on metal or plastic materials for wear and corrosion resistance or cosmetic enhancement. In the case of phosphorus-nickel plating on a metal (PEN), the phosphorus content of typically 2-14% determines the metallurgical properties of the nickel alloy coating. A stabilizer such as lead is co-deposited with the nickel to slow down the reduction speed. Measurement and control of these elements in the plating bath and deposited coating is important for optimum product quality. To meet this industry need, Applied Rigaku Technologies offers the NEX DE VS benchtop EDXRF system. Easy to operate at-line or in the lab, the NEX DE VS uses a special fundamental parameters application method that automatically calculates the plated coating thickness and composition and measures liquids using simple empirical calibration. NEX DE VS automatic switching collimators also offer small spot measurement down to 1mm spot size for measuring plating on smaller pieces.

EDXRF products from Rigaku

High-performance, Cartesian-geometry EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin films

New variable collimator small spot 60 kV EDXRF system featuring QuantEZ software.

New 60 kV EDXRF system featuring QuantEZ software and optional standardless analysis

Low-cost EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin-films

Performance EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin-films

EDXRF spectrometer with powerful Windows® software and optional FP.

Scanning multi-element process coatings analyzers for web or coil applications

EDXRF multi-element process analyzer; analyze aluminum (Al) through uranium (U)