WDA-3650
Features
- Simultaneous evaluation of film thickness and composition
- Applicable to all film types
- Accepts 200 mm and smaller wafers and media disks
- Capable of high analytical performance, accuracy, and stability
- Patented "diffraction avoidance" capability for accurate XRF results
- High-sensitivity Boron analysis (with AD-Boron channel)
- Available auto-calibration function with the optional C-to-C auto loader previously only found on the WaferX 300
- Oil-free transformer X-ray generator
- Electric consumption reduced 23% from previous model
Simultaneous WDXRF spectrometer
Film thickness and composition measurements on wafers and media disks
Specifications
Product name | WDA-3650 |
Technique | Simultaneous wavelength dispersive X-ray fluorescence |
Benefit | Thickness and composition of multi-layer stacks for ≤ 200 mm wafers |
Technology | 4kW, Rh-anode WDXRF with XYθ sample stage |
Core attributes | 20 channels max., fixed type (₄Be ~₉₂U), scanning type (₂₂Ti ~₉₂U), CE marked, GEM/SECS, SEMI S2 |
Core options | AD-Boron channel for greater sensitivity, auto-calibration function with C-to-C auto loader |
Computer | Internal PC, MS Windows® OS |
Core dimensions | 1120 (W) x 1450 (H) x 890 (D) mm |
Mass | 600 kg (core unit) |
Power requirements | 3Ø, 200 VAC 50/60 Hz, 30 A or 1Ø, 220-230 VAC 50/60 Hz 40 A |