Winter 2012, Volume 28, No. 1
27-28
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Total reflection X-ray fluorescence (TXRF) spectrometry is widely used in semiconductor manufacturing processes for nondestructive analyses of metallic contamination on wafer surfaces. Sensitivity requirements for such devices have increased in recent years. Currently, metallic contamination in advanced device manufacturing processes is controlled to 10⁸ atoms/cm². In a conflicting trend, the growing diversification of semiconductor devices has generated demand for low-cost equipment with advanced functionality rather than sensitivity. The TXRF 3800e is a low-cost, total reflection X-ray fluorescence spectrometer with advanced functions that meets these demands.