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Rigaku presents its X-ray analytical instrumentation at ESSDERC / ESSCIRC 2019

Rigaku is Diamond Sponsor at ESSDERC/ESSCIRC in Kraków, Poland

September 24, 2019 – Kraków, Poland. Rigaku Corporation, a global leader in X-ray analytical technology, is pleased to announce its attendance at the joint meeting of the 49th European Solid State Device Research Conference (ESSDERC) and 45th European Solid State Circuits Research Conference (ESSCIRC).  ESSDERC/ESSCIRC is taking place Monday, September 23, through Thursday, September 26, 2019 at the Jagiellonian University Auditorium Maximumin in Kraków, Poland.

The conferences provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.  The increasing level of integration for system-on-chip design made available by advances in semiconductor technology requires a deeper interaction among technologists, device experts, and designers of integrated circuits and systems. While keeping separate Technical Program Committees, ESSDERC and ESSCIRC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both communities.  

Rigaku, a leading supplier of X-ray metrology tools, is the sole Diamond sponsor of the event and is a pioneer and world leader in designing and manufacturing X-ray based measurement tools to solve semiconductor manufacturing challenges.

With over 35 years of global market leadership in the semiconductor industry, Rigaku solutions employ X-ray fluorescence (XRF), diffraction (XRD), and reflectometry (XRR) techniques and enable everything from in-fab process control metrology to R&D for thin film and materials characterization, as well as total-reflection XRF spectrometers (TXRF) with integrated vapor phase decomposition (VPD) for trace contamination monitoring.

Systems of note from Rigaku include the Rigaku TXRF-V310 semiconductor metrology system for ultra-trace analysis of elemental surface contamination. The tool employs TXRF analysis for measuring contamination in all fab processes, including cleaning, litho, etch, ashing, and films, It can measure elements from sodium (Na) through uranium (U) with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system.

The Rigaku MFM310 system is designed for high-volume manufacturing and performs high-precision measurements not possible by optical or ultrasonic techniques. A sophisticated X-ray metrology tool, it enables performance of high-throughput measurements on product and blanket wafers, ranging from ultrathin single-layer films to multilayer stacks.

Also featured is the next-generation Rigaku SmartLab intelligent multipurpose X-ray diffractometer with SAXS and in-plane capabilities. It features the brand new PhotonMax high-flux 9 kW rotating anode X-ray source coupled with a Rigaku HyPix-3000 high-energy-resolution 2D multidimensional semiconductor detector that supports 0D, 1D and 2D measurement modes. The system incorporates a high-resolution θ/θ closed loop goniometer drive system with an available in-plane diffraction arm.

More information about X-ray based measurement tools from Rigaku for semiconductor manufacturing is available at www.rigaku.com/products/semi.

 

 

For further information, contact:

Michael Nelson

Rigaku Global Marketing Group

tel: +1. 512-225-1796

michael.nelson@rigaku.com