ONYX 3000
2D Microscope
2D Microscope Magnification
3D Scanner
Features
- Optimal configuration for bumps inspection
- Array of 4 silicon drift detectors (SDD) with large active area and 123 eV FWHM
(@5.9 keV) resolution - Measures light (low-energy) elements (carbon, oxygen, magnesium, aluminum, and phosphorous) using an optional helium atmosphere and special SDD detectors
- Monochromatic or polychromatic X-ray options
- Inspects micro-features through focused vertical X-ray beam (down to 10 µm diameter for polychromatic optics and 20 µm diameter for monochromatic optics)
- Advanced motion platform for sub-micron accuracy
- Precise 3D geometrical inspection of features: micro-bumps, pillars, and pads
- Composition analysis associated with FinFET structures
- Fully automated calibration processes, ensuring long-term stability and consistency, and tube aging correction
- In line with SECS/GEM communication protocols
Is wafer level packaging an issue for your semiconductor manufacturing process? Explore ONYX 3000
Bump Inspection System
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In-Line Non-Destructive Wafer Inspection And Metrology
Hybrid configuration | automated X-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers
Specifications
Product Name | ONYX 3000 |
Metrology Type | Micro-spot EDXRF and optical inspection (2D-3D) |
Benefit | Measure ultra-thin single-layer films to multi-layer stacks; Characterize BEOL and WLP structures |
Technology | Hybrid configuration | Automated X-ray analysis, 3D scanning, and 2D microscope |
Core attributes |
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Wafer Size | Up to 300 mm |
Wafer Type | Blanket and patterned wafers |
X/Y Stage Resolution | < 1 µm (Stage resolution 0.1 µm) |
Sample Handling | Magazine robot |
Automation | Full wafer capability with single or dual automatic loader |
Navigation | Precise stage complemented with an image recognition algorithm. Sub-micron fast navigation to single feature center |
SW User Interface | Auto calibration. Ease-of-use recipe creation and maintenance. Fundamental parameters optional. |
Micro XRF Beam Orientation | Vertical incidence micro-spot XRF |
X-ray tube energy | Up to 50 kV, 50 W |
Optics | Polycapillary / COLORS™ (monochromatic X-ray optics) |
Micro XRF beam Spot Size | 10-50 µm spot sizes adjustable |
Detector Type | Silicon drift detector (SDD) Optional: light element detector (C,N,O,F.S) |
Detector Resolution | 123 ± 5 eV with a large solid angle |
DPP | Digital Pulse Processor | High efficiency of more than 1 million photons/sec. |
Computer | Internal PC, MS Windows® OS |
Core dimensions | 1430 (W) x 3220 (D) x 2125 (H) mm |
Mass | 2600 kg approx. |
Power requirements | 208 VAC 3-phase 50/60 Hz 25 A |
Applications

Single Bump Metrology
Measure and monitor Ag%, Sn%, Ni layers, Cu thickness, and total bump height:- Measure single-solder bumps as small as 10 μm diameter
- Inspect a range of parameters: across the wafer, wafer-to-wafer, and lot-to-lot
- Measure CD and a total height of single bumps using a 2D microscope, 3D scanner, and built-in sensors
Thin Films Measuring and Monitoring
Measure and monitor thickness and composition of precious metal thin films:- Analyze ultra-thin films of any type of element, regardless of their physical properties


UBM/RDL
Conduct metallurgical inspections of under bump metallization (UBM) and redistribution layers (RDL):- Analyze multi-stack structures and thick monolayers, for layer thickness and composition
- Distinguish separate layers simultaneously
Alloy Compositions
Measure and monitor metals and alloy composition:- Analyze metal elements (Ga, P, Co, Ni, Fe, Pt, Cr, Zn, and Mn)
- Identify alloys (NiFe, CoNi, NiP, NiPt, and CrMn)

