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    XHEMIS EX-2000

    XRR and EDXRF Metrology Tool for Blanket Wafers

    Thickness, density, roughness, and composition of films on blanket wafers

    In-line high-volume semiconductor manufacturing

    This versatile X-ray metrology tool uses X-ray fluorescence (EDXRF) and X-ray reflectivity (XRR) for high-throughput non-destructive measurement of thickness and density of blanket wafers ranging from ultrathin single-layer films to multilayer stacks for process development and film quality control.

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    XHEMIS EX-2000 Overview

    Designed for high-volume manufacturing

    XHEMIS EX-2000 is designed for high-volume manufacturing of up to 200 mm wafers. Outstanding stage alignment before measurement enables quick and accurate measurement of a variety of wafer samples. The highly accurate stage control enables full-surface mapping measurements in a short time.

    User-friendly designed tool

    When equipped with a transfer robot, XHEMIS EX-2000 can handle wafers automatically. AutoCal (an automatic calibration function) maintains constant tool conditions. User-friendly software makes tool operation and data analysis easy. This tool can be used for a variety of applications from research to production for quality control.

    Application examples

    Barrier metal, Al/W wire, W process, backside electrode, oxide/nitride films, LED, filters, power devices, MEMS

    XHEMIS EX-2000 Features

    Wide range of materials and applications
    Simultaneous evaluation of film thickness, density and roughness
    High-throughput wafer measurements
    Absolute results from XRR (no calibration standards required)
    Full-wafer mapping and high-speed measurements by XRF
    High resolution and precision covering thicknesses from Ångstroms to microns
    Accepts 200 mm, 150 mm, 125 mm and 100 mm wafers
    Available auto-calibration function

    XHEMIS EX-2000 Specifications

    Technique X-ray reflectometry (XRR), energy-dispersive X-ray fluorescence (EDXRF)
    Benefit Measure ultra-thin single-layer films to multi-layer stacks.
    Obtain film thickness, density, and roughness by XRR (without standards)
    Obtain thickness / composition by XRF (with standards)
    Technology XRR and small-spot XRF
    Attributes Blanket wafer metrology
    Cu sealed-tube source for XRR; Cr sealed-tube source for XRF
    EDXRF spot size ~ 2 mm diameter
    Features XYθ sample stage
    Auto loader
    Options Pd sealed-tube source for XRF (optimal for Al)
    SECS/GEM software
    Dimensions 1250 (W) x 1825 (H) x 2400 (D) mm (with auto loader)
    Measurement results EDXRF: Film thickness and composition
    XRR: Film thickness, density, and roughness

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