X-ray Topography Systems

X-ray topography from Lab to Fab

High-resolution, non-destructive wafer defect imaging for every stage of semiconductor manufacturing

• Three configurations: Lab, Near-Fab, and Fab systems for seamless R&D to production scaling
• Up to 300 mm wafers with full-wafer, non-destructive defect detection
• Multi-material support: Si, SiC, GaN, InP, GaAs, AlN, Ga₂O₃, Sapphire, and more
• SEMI-compliant QC tools for TSD, BPD and MP quantification in SiC

The XRTmicron Series is Rigaku’s high-resolution X-ray topography (XRT) platform, designed to detect and quantify crystallographic defects across single crystalline materials such as semiconductor wafers and epitaxial layers on wafers. With configurations tailored for R&D labs, pilot lines, and full-scale fabs, XRTmicron enables end-to-end defect visualization and yield optimization across the semiconductor value chain. By combining non-destructive measurement, cleanroom compatibility, and advanced automation, the XRTmicron Series delivers accurate defect maps and statistical analysis of dislocations. It bridges the gap between research innovation and manufacturing reliability, empowering fabs to accelerate development, optimize crystal growth, and secure long-term device performance.