Process XRR, XRF, and XRD metrology tool for blanket and patterned wafers; up to 300 mm wafers
Advanced state-of-the-art high-resolution XRD system powered by Guidance expert system software
This versatile X-ray metrology tool enables high-throughput measurements on blanket wafers ranging from ultra-thin single-layer films to multilayer stacks for process development and film quality control.
TMA is the measurement of a change in dimension or mechanical property of the sample while it is subjected to a controlled temperature program.
DSC is a thermal analysis technique that quantifies the amount of energy in a reaction.
TMA/HUM measures change in dimension or mechanical property of a sample while subjected to a temperature regime under water vapor atmosphere with a constant relative humidity.
The compact humidity generator (HUM-1) is connected to the TG-DTA for measurements under constant relative humidity water vapor atmosphere.
TG-DTA is a hyphenated technology generally referred to as simultaneous thermal analysis (STA).