Non-destructive residual stress analysis for metals
Residual stress may be created during the manufacturing process of a material, or it may accumulate in a structure over many years in operation. In either case, this stress can have a serious negative effect on a product's quality, durability and lifetime. Accurate detection of residual stress is an important element of the quality control process and helps predict the service lifetime of products.
X-ray diffraction (XRD) is presently the only accurate way to non-destructively measure residual stress. In addition, XRD offers non-contact measurements with unsurpassed spatial resolution and the ability to measure hardened materials. Residual stress, of either exceptionally strained points or the surfaces of moving parts, is routinely determined by XRD. To meet the requirements of these tasks, Rigaku offers several systems to allow flexible component and sample handling for every budget and need.
Rigaku recommends the following products:
The world’s smallest portable stress analyzer that is specifically designed for field analysis
Advanced state-of-the-art high-resolution XRD system powered by Guidance expert system software
Highly versatile multipurpose X-ray diffractometer with built-in intelligent guidance
Laboratory micro-spot XRD residual stress analysis with both iso- and side-inclination methods
High-performance, multi-purpose XRD system for applications ranging from R&D to quality control