Dramatic improvement in the throughput of X-ray topography

Abstract

Rigaku launched a high-speed X-ray topography system with the improved throughput of 10–20 wafers/hour (3–6 min/wafer). High-speed image acquisition is achieved using an uncollimated divergent beam and the HyPix-3000HE hybrid pixel detector. This technical note explains two major features that contribute to this improvement by dramatically reducing the time for alignment and the travel distance of the specimen to obtain topographic images of the whole area. This high-speed X-ray topography system is poised to play a key role in the quality control of wafers.