A printed circuit board or PCB is usually composed of epoxy resin with reinforced woven glass fibers where electrical components and conducting layers are mounted. The PCB board and the components mounted in it should have identical coefficient of thermal expansion or CTE values to prevent thermal stresses and ensures a longer lifetime. The CTE of a material can be evaluated using the thermomechanical analysis or TMA and changes in CTE values are used not only to characterize the glass transition temperature of a material, but also as a very important parameter for assessing product stability. In this application, we compare the expansion behavior and CTE values of a decade old PCB and a new PCB using TMA with differential type compression loading attachment effective for measuring samples with <2mm in thickness.
TG-DTA is a hyphenated technology generally referred to as simultaneous thermal analysis (STA).
DSC is a thermal analysis technique that quantifies the amount of energy in a reaction.
Quantifies the energy changes in reactions such as melting, transition, crystallization and glass transition temperature.
DSC8271 is a high-temperature type DSC with a maximum temperature of 1,500°C.
TMA is the measurement of a change in dimension or mechanical property of the sample while it is subjected to a controlled temperature program.
The compact humidity generator (HUM-1) is connected to the TG-DTA for measurements under constant relative humidity water vapor atmosphere.
TMA/HUM measures change in dimension or mechanical property of a sample while subjected to a temperature regime under water vapor atmosphere with a constant relative humidity.
In TG-FTIR, gases evolved by volatilization or thermal decomposition are qualitatively analyzed, which allows you to track changes in the generated amount along with the temperature change.