Advanced state-of-the-art high-resolution XRD system powered by Guidance expert system software
Highly versatile multipurpose X-ray diffractometer with built-in intelligent guidance
Laboratory micro-spot XRD residual stress analysis with both iso- and side-inclination methods
Process XRR, XRF, and XRD metrology tool for blanket and patterned wafers; up to 300 mm wafers
This versatile X-ray metrology tool enables high-throughput measurements on blanket wafers ranging from ultra-thin single-layer films to multilayer stacks for process development and film quality control.
TMA is the measurement of a change in dimension or mechanical property of the sample while it is subjected to a controlled temperature program.
DSC is a thermal analysis technique that quantifies the amount of energy in a reaction.